AGFD023R24C2I2V
AGFD023R24C2I2V
Part number:
544-AGFD023R24C2I2V-ND
Product_Category
System On Chip (SoC)
Manufacturer
Intel
Type
IC
Encapsulation
Package
Tray
RoHS:
YES
Quantity
0
Minimun: 1
multiples: 1
Quantity
Price
Total
AGFD023R24C2I2V NEWS
Specifications
TYPEDESCRIPTION
MfrIntel
SeriesAgilex F
PackageTray
Product StatusACTIVE
Package / Case2340-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O480
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.3M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2340-BGA (45x42)
ArchitectureMPU, FPGA